About NIDEC-READ CORPORATION
Credibility built on market-proven technology.
Technology developed in order to meet market needs has been contributing in the production lines around the world.
Born out of the need for high-speed, high-accuracy measurement/ inspection of fast-evolving electronic components, NIDEC-READ products reflect the culmination of our longstanding experiences in a variety of elemental technologies. Our technical portfolio today realizes extensive application in:
- mission-critical, high-performance integrated circuits and associated software
- hardware design enabling submicron control
- component fixture operation for processing and assembling multi-pin and narrow-pitch chips, and
- two- and three-dimensional optical imaging and three-dimensional process technology
NIDEC-READ’s main strength derives from the ability to blend a wide range of elemental technologies to the industry's highest level of performance.
NIDEC-READ GATS (Grid Array Testing System) series carry out open/leak circuit tests on semiconductor package (MCM/CSP/BGA).
NIDEC-READ offers an array of testing equipment used to conduct open/leak tests on motherboards, as well as many other printed circuit boards. They can be flexibly configured according to applications in terms of size, type, and the number of test pins required.
NIDEC-READ testers undertake various types of continuity tests at broad voltage and resistance levels.
In addition to jigs and fixtures for probing conductors and electrode pads, NIDEC-READ provides specialized software for test point selection and log analysis.
MEMS Spring Probe is developed by NIDEC-READ original ultra-fine 3D processing technology and enables our customer to supply advanced and innovative test solutions at PCB & semiconductor testing market.
NIDEC-READ provides open/leak inspection system for touch screen panel and LCD, at singulated size to multifaced size, making use of our diversed contact & non-contact technologies.
NIDEC-READ's inspection systems serve to locate open/leak circuits on printed substrates forming different conductor patterns within photomasks and inner/outer layers. These vision inspection systems are also used to measure the shape of via holes and solder bumps and to find scratches and stains on them.
NIDEC-READ's auto parts inspection systems and specific application systems collectively support the customers' productivity improvement by working in their process lines around open/leak the current test and post-packaging.