STAR REC M6II Wide is a standard open/leak test system for high density interconnect board. It is suitable for testing substrate utilized for electrical devices such as smartphone.
- Achived total alignment accuracy +-7.5μm and capable of ultra-fine pitched substrate test. (In common with M6ⅡSW)
- Upper and lower test points are maximum 16K and both dedicated & universal fixture is available (In common with M6ⅡSW).
- Maxmum work size
W260mm x D200mm