Optical Vision
Inspection System

NIDEC-READ's inspection systems serve to locate open/leak circuits on printed substrates forming different conductor patterns within photomasks and inner/outer layers. These vision inspection systems are also used to measure the shape of via holes and solder bumps and to find scratches and stains on them.

Wafer Bump Inspection System

Wafer Bump Inspection System

RWi/TWi series is an optical 2D/3D inspection system measuring variety types of bump build on a surface of semiconductor wafer.

Substrate Bump Inspection System

Substrate Bump Inspection System

RSH series is an optical inspection system for semiconductor package measuring bump height and visual simoultaneously.

3D Surface Profiling & Measuring System

3D Surface Profiling & Measuring System

The equipment is making use of white light interferometry to measure surface profile of material at nano level.

Photomask Inspection System

Photomask Inspection System

MaskView series is a photomask inspection system for PCB, semiconductor package and LED wafer.