Semiconductor Package Inspection System
NIDEC-READ GATS (Grid Array Testing System) series carry out open/leak circuit tests on semiconductor package (MCM/CSP/BGA) and is available for a wide spectrum of middle to large-sized circuit substrates.
GATS-2128 is an open/leak test system for high density interconnect inspection such as FC-BGA and MCM.
GATS-6310 is a next generation inspection system, which is suitable for fine-pitched, ultrathin FP-CSP, fulilling both high speed and high accuracy requirements.
GATS-7711 is a standard model of open/leak inspection system, particularly effective for multifacetd semiconductor package such as FC-CSP.
GATS-7750 is an open/leak test equipment developed for further sophistication of FC-CSP. High speed and high accuracy test model.
GATS-7850 is a next generation open/leak inspection model which has been developed for 250mm sized square panel type of FC-CSP.