Package Inspection

NIDEC-READ GATS (Grid Array Testing System) series carry out open/leak circuit tests on semiconductor package (MCM/CSP/BGA).

Circuit Board
Inspection System

NIDEC-READ offers an array of testing equipment used to conduct open/leak tests on motherboards, as well as many other printed circuit boards. They can be flexibly configured according to applications in terms of size, type, and the number of test pins required.

Fixture and
Software for
Open/Leak Inspection

In addition to jigs and fixtures for probing conductors and electrode pads, NIDEC-READ provides specialized software for test point selection and log analysis.

MEMS Spring

MEMS Spring Probe is developed by NIDEC-READ original ultra-fine 3D processing technology and enables our customer to supply advanced and innovative test solutions at PCB & semiconductor testing market.

Inspection System

NIDEC-READ provides open/leak inspection system for touch screen panel and LCD, at singulated size to multifaced size, making use of our diversed contact & non-contact technologies.

Optical Vision
Inspection System

NIDEC-READ's inspection systems serve to locate open/leak circuits on printed substrates forming different conductor patterns within inner/outer layers. These vision inspection systems are also used to measure the shape of via holes and solder bumps and to find scratches and stains on them.

Auto Parts
Inspection System
and Others

NIDEC-READ's auto parts inspection systems and specific application systems collectively support the customers' productivity improvement by working in their process lines around open/leak the current test and post-packaging.